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PC-FR

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Open electronics enclosure and lids printed in PC FR
Electronics enclosure · PC FR Image source: Bambu Lab

FDM

Bambu Lab PC-FR is a flame-retardant polycarbonate for demanding engineering applications. It combines the robust character of polycarbonate with heat resistance and a formulation designed to limit flame propagation. It is a candidate when standard materials do not meet the required thermal and mechanical conditions.

Application examples include electronics enclosures, covers, equipment brackets and functional prototypes. These parts help evaluate installation, fastening and handling under realistic conditions. Stiff enclosure walls combined with loaded mounting points are a typical design case.

The material's flame-retardancy tests apply under specified conditions. Wall thickness, geometry and the evidence required for your particular component are assessed separately. Dried filament and controlled temperatures support print quality.

Material information: Bambu Lab

Application ideas

Properties and test conditions

PropertyValue / condition
Manufacturer / gradeBambu Lab · PC FR · Identity from input list; see PDF for version
Density1.18 g/cm³ · ISO 1183, Bambu TDS V1.0
Heat deflection temperature113 °C · ISO 75, 0.45 MPa; test state in TDS; not a continuous service temperature

Source review: 2026-10-03

Limitations and post-processing

Suitability depends on geometry, orientation, print profile and material condition. Drying, annealing, or washing and post-curing are material- and profile-specific. Material data do not certify a part.